Moisture absorption and desorption in wafer level chip scale packages
نویسندگان
چکیده
Article history: Received 28 May 2015 Received in revised form 18 June 2015 Accepted 29 June 2015 Available online xxxx
منابع مشابه
Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part II: Application to 3D Ultrathin Stacked-Die Chip Scale Packages
In the present study, the direct concentration approach (DCA) and the whole-field vapor pressure model developed in Part I of this work (Xie et al., 2009 “Direct Concentration Approach of Moisture Diffusion and Whole Field Vapor Pressure Modeling for Reflow Process: Part I–Theory and Numerical Implementation,” ASME J. Electron. Packag., 131, p. 031010) is applied to 3D ultrathin stacked-die chi...
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ورودعنوان ژورنال:
- Microelectronics Reliability
دوره 55 شماره
صفحات -
تاریخ انتشار 2015